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PRELIMINARY DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8182TB
3 V, 2.9 GHz SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS
DESCRIPTION
The PC8182TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC is low current consumption and wide band than PC2771TB. This IC is manufactured using NEC's 25 GHz fT UHS0 silicon bipolar process. This process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
* High-density surface mounting * Supply voltage * Circuit current * Medium output power : 6-pin super minimold package (2.0 x 1.25 x 0.9 mm) : VCC = 2.7 to 3.3 V : ICC = 30 mA TYP. @ VCC = 3.0 V : PO(1dB) = +9.5 dBm TYP. @ f = 0.9 GHz PO(1dB) = +9.0 dBm TYP. @ f = 1.9 GHz PO(1dB) = +8.0 dBm TYP. @ f = 2.4 GHz * Power gain : GP = 21.5 dB TYP. @ f = 0.9 GHz GP = 20.5 dB TYP. @ f = 1.9 GHz GP = 20.5 dB TYP. @ f = 2.4 GHz * Upper limit operating frequency : fu = 2.9 GHz TYP. @ 3 dB bandwidth
APPLICATION
* Buffer amplifiers on 1.9 GHz to 2.4 GHz mobile communications system.
ORDERING INFORMATION
Part Number Package 6-pin super minimold Marking C3F Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face to perforation side of the tape. Qty 3 kp/reel.
PC8182TB-E3
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PC8182TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P14543EJ1V0DS00 (1st edition) Date Published December 1999 N CP(K) Printed in Japan
(c)
1999
PC8182TB
PIN CONNECTIONS
Pin No. Pin Name INPUT GND GND OUTPUT GND VCC
(Top View) 3 2 1
(Bottom View)
1
C3F
4 5 6
4 5 6
3 2 1
2 3 4 5 6
PRODUCT LINE-UP (TA = +25 C, VCC = Vout = 3.0 V, ZS = ZL = 50 )
fu (GHz) 2.9 PO (1 dB) (dBm) +8.0 @ f = 0.9 GHz +7.0 @ f = 1.9 GHz 2.7 +9.5 @ f = 0.9 GHz +6.5 @ f = 1.9 GHz 2.2 +11.5 @ f = 0.9 GHz +9.5 @ f = 1.5 GHz 2.9 +9.0 @ f = 1.9 GHz +8.0 @ f = 2.4 GHz GP (dB) 13.0 @ f = 0.9 GHz 15.5 @ f = 1.9 GHz 20.0 @ f = 0.9 GHz 21.0 @ f = 1.9 GHz 21.0 @ f = 0.9 GHz 21.0 @ f = 1.5 GHz 20.5 @ f = 1.9 GHz 20.5 @ f = 2.4 GHz 30.0 36.0 27.0 ICC (mA) 26.5
Part No.
Package 6-pin minimold 6-pin super minimold 6-pin minimold 6-pin super minimold 6-pin minimold 6-pin super minimold 6-pin super minimold
Marking C1Z
PC2762T PC2762TB PC2763T PC2763TB PC2771T PC2771TB PC8182TB
C2A
C2H
C3F
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Notice The package size distinguishes between minimold and super minimold.
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Preliminary Data Sheet P14543EJ1V0DS00
PC8182TB
SYSTEM APPLICATION EXAMPLE Digital cellular telephone
RX I Q
DEMO
/N SW
PLL PLL
I 0 TX PA
PC8182TB
Phase shifter 90 Q
Preliminary Data Sheet P14543EJ1V0DS00
3
PC8182TB
PIN EXPLANATION
Applied Voltage (V) - Pin Voltage (V)
Note
Pin No.
Pin Name
Function and Applications
Internal Equivalent Circuit
1
INPUT
-
Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. Signal output pin. The inductor must be attached between VCC and output pins to supply current to the internal output transistors.
6
4
OUTPUT
Voltage as same as VCC through external inductor 2.7 to 3.3
-
4
1
6
VCC
-
Power supply pin, which biases the internal input transistor. This pin should be externally equipped with bypass capacitor to minimize its impedance. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
3 GND 2 5 GND
2 3 5
GND
0
-
Note Pin voltage is measured at VCC = 3.0 V.
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Preliminary Data Sheet P14543EJ1V0DS00
PC8182TB
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Total Circuit Current Power Dissipation Symbol VCC ICC PD Conditions TA = +25 C, pin 4 and 6 TA = +25 C Mounted on double copper clad 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85 C) Ratings 3.6 60 200 Unit V mA mW
Operating Ambient Temperature Storage Temperature Input Power
TA Tstg Pin TA = +25 C
-40 to +85 -55 to +150 +10
C C dBm
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Voltage Symbol VCC MIN. 2.7 -40 TYP. 3.0 MAX. 3.3 Unit V Remark Same voltage should be applied to pin 4 and 6. -
Operating Ambient Temperature
TA
+25
+85
C
Preliminary Data Sheet P14543EJ1V0DS00
5
PC8182TB
ELECTRICAL CHARACTERISTICS (TA = +25 C, VCC = Vout = 3.0 V, ZS = ZL = 50 )
Parameter Circuit Current Power Gain Symbol ICC GP No signal f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz Noise Figure NF f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz Upper Limit Operating Frequency Isolation fu ISL 3 dB down below from gain at f = 0.1 GHz f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz Input Return Loss RLin f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz Output Return Loss RLout f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz 1 dB Gain Compression Output Level PO (1dB) f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz Saturated Output Power Level PO (sat) f = 0.9 GHz, Pin = -5 dBm f = 1.9 GHz, Pin = -5 dBm f = 2.4 GHz, Pin = -5 dBm Test Conditions MIN. 22.0 19.0 17.5 18.0 - - - 2.8 30 27 28 6 8 9 8 9 11 +7.5 +7.0 +5.5 - - - TYP. 30.0 21.5 20.5 20.5 4.5 4.5 5.0 2.9 33 32 31 8 10 12 10 11 14 +9.5 +9.0 +8.0 +10.5 +10.0 +9.5 MAX. 38.0 25.0 23.5 24.0 6.0 6.0 6.5 - - - - - - - - - - - - - - - - dBm dBm dB dB GHz dB dB Unit mA dB
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Preliminary Data Sheet P14543EJ1V0DS00
PC8182TB
TEST CIRCUIT
VCC 1 000 pF C3 6 50 IN 1 000 pF C1 1 4 L C2 1 000 pF 50 OUT
2, 3, 5
COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS
Type C1, C2 C3 L Bias Tee Capacitor Bias Tee Value 1 000 pF 1 000 pF 1 000 nH
EXAMPLE OF ACTUAL APPLICATION COMPONENTS
Type C1 to C3 L Chip capacitor Chip inductor
Value 1 000 pF 100 nH 10 nH
Operating Frequency 100 MHz or higher 100 MHz or higher 2.0 GHz or higher
INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output transistor, connect an inductor between the Vcc pin (pin 6) and output pin (pin 4). Select large value inductance, as listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor make output-port-impedance higher to get enough gain. In this case, large inductance and Q is suitable. For above reason, select an inductance of 100 or over impedance in the operating frequency. The gain is a peak in the operating frequency band, and suppressed at lower frequencies. The recommendable inductance can be chosen from example of actual application components list as shown above. CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS Capacitors of 1 000 pF are recommendable as the bypass capacitor for the Vcc pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the Vcc pin is used to minimize ground impedance of Vcc pin. So, stable bias can be supplied against Vcc fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2Rfc).
Preliminary Data Sheet P14543EJ1V0DS00
7
PC8182TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
Top View
3 1
IN
5 4 3F
OUT C
L
2
C
C
Mounting direction VCC C
COMPONENT LIST
Value C L 1 000 pF Example: 10 nH
6
Notes 1. 30 x 30 x 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes
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Preliminary Data Sheet P14543EJ1V0DS00
PC8182TB
PACKAGE DIMENSIONS
6 PIN SUPER MINIMOLD (UNIT: mm)
0.1 MIN.
0.22 0.1
0.13 +0.1 -0.02
1.25 0.1
2.1 0.1
0 to 0.1
0.65 1.3
0.65
0.7 0.9 0.1
2.0 0.2
Preliminary Data Sheet P14543EJ1V0DS00
9
PC8182TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC pin. (4) The inductor must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be attached to input pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235 C or below Time: 30 seconds or less (at 210 C) Note Count: 3, Exposure limit: None Package peak temperature: 215 C or below Time: 40 seconds or less (at 200 C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260 C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300 C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Partial Heating
-
Note After opening the dry pack, keep it in a place below 25 C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
10
Preliminary Data Sheet P14543EJ1V0DS00
PC8182TB
[MEMO]
Preliminary Data Sheet P14543EJ1V0DS00
11
PC8182TB
ATTENTION
OBSERVE PRECAUTIONS FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

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